Onsite RF Semiconductor Packaging Engineer

Posted 4 hours ago

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About the role

  • RF Semiconductor Packaging Engineer at Qorvo developing advanced RF semiconductor packaging technologies in collaboration with design and manufacturing teams.

Responsibilities

  • Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
  • Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
  • Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving.
  • Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
  • Develop and deploy advanced design rules into next generation products.
  • Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products.

Requirements

  • Bachelors degree in Mechanical Engineering, Electrical Engineering, Material Science, or a related field
  • 0-2 years of experience
  • Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
  • Understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment.
  • Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D).
  • Strong communication and presentation skills.
  • Ability to excel in a dynamic collaborative team environment including working directly with the product line design teams.

Benefits

  • We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants.
  • Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
  • Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

Job title

RF Semiconductor Packaging Engineer

Job type

Experience level

Junior

Salary

Not specified

Degree requirement

Bachelor's Degree

Tech skills

Location requirements

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