Digital System Architect in semiconductor industry writing specifications and leading cross - functional teams on designs. Based in UK, Switzerland, or Germany in a hybrid model.
KA
Kandou
Currently Hiring
About the company
Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry.
Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective.
Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF.
These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems.
Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.
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13 jobs found
Modeling Engineer developing software for system - level modeling of communication systems. Collaborating with architects and design teams in a semiconductor company focused on innovation.
DFT Engineer specializing in test pattern development and debugging within high - speed chip solutions. Collaborating with engineering teams to ensure high coverage metrics and silicon functionality.
Package Design Engineer at Kandou developing high - speed chip - chip link solutions in semiconductor industry. Collaborating with engineering and marketing teams on packaging requirements.
EDA/CAD Engineer responsible for maintaining integrated EDA environments and developing robust CAD flows. Leading vendor management and providing support for PDKs in Switzerland or UK.
Digital EDA/CAD Engineer contributing to IC design tools and methodologies for high - speed chip solutions. Leading evaluations and training for engineering design teams in semiconductor industry.
Director of Software Engineering leading software development for high - speed semiconductor technology. Defining architecture and engaging customers for robust software solutions.
Analog Design Engineer at Kandou focusing on high - speed serdes transceivers in advanced technology nodes. Collaborating across teams for analog design, verification, and customer support.
Analog Layout Engineer (Lead) specializing in custom layout and verification of high - speed circuits for chip - to - chip communication. Key responsibilities include collaborating with design teams and customer interactions.
Packaging Engineer responsible for all packaging engineering activities at Kandou. Driving assembly manufacturing and ensuring quality standards for semiconductor products.
Memory Systems Engineer at Kandou focusing on DRAM subsystem design and FPGA prototyping in Switzerland. Collaborating on architectural performance simulations and validation plans for memory controllers.
Foundry Technology Engineer at Kandou managing silicon manufacturing processes and collaborations with foundry partners. Driving quality, accountability, and performance through comprehensive engineering initiatives.