Onsite Lead Thermal Engineer, Hardware Design

Posted 6 hours ago

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About the role

  • Lead Thermal Engineer designing cutting-edge cooling solutions for AI servers and high-performance tech systems at Celestica. Collaborate cross-functionally in a non-confrontational environment.

Responsibilities

  • Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing.
  • Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs.
  • Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products.
  • Conceive and implement ways to enhance and extend operation of heat transfer hardware.
  • Consider the thermal aspects of chip packaging technologies.
  • Apply best-in-class fluid flow geometry and technology to cool high heat flux chips.
  • Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
  • Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
  • Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates.
  • Plan your work to achieve full required performance, and stay on schedule to support overall product development.
  • Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications.
  • Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation.
  • Document thermal test plans, devise and build test stands, including techanical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording.
  • Analyze test data to draw inferences about the equipment tested.
  • Apply statistical methods as required to maximize utilization of data and test usefulness.
  • Work with multi-disciplinary groups to define system requirements and design products.
  • Work with cross-functional teams to identify root causes of system performance.

Requirements

  • Must have relevant coursework in heat transfer and fluid mechanics
  • good familiarity with 3D software applications
  • BA or MBA degree in Engineering
  • Preference giving to candidates with a Master’s degree in Thermodynamic Engineering

Benefits

  • Equal Opportunity Employer
  • Employee login

Job title

Lead Thermal Engineer, Hardware Design

Job type

Experience level

Senior

Salary

Not specified

Degree requirement

Bachelor's Degree

Tech skills

Location requirements

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