AI Solutions Architect designing and implementing effective AI solutions utilizing various technologies. Working under supervision to solve routine problems and address clients' needs with strategic AI architectures.
About the role
- Sr Principle Solutions Engineer at Cadence defining advanced packaging and 3DIC analysis flows for customer solutions. Expert in Cadence toolset and signal integrity, power integrity.
Responsibilities
- defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions
- have expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints
- design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design
- have the ability to analyze the customer's environment and evaluate appropriate solutions
- be knowledgeable and aware of competitive technologies
- anticipate technical issues and develop creative solutions before they become a problem
- take technical lead on a wide range of projects
- ability to understand high-speed, high-performance signal and power integrity-related issues and work with peers and other business groups
- able to communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers
- understand customer success criteria and is committed to ensuring customer success
Requirements
- Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
- Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design is required
- 5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP preferred
- Strong knowledge of advanced packaging concepts
- Strong knowledge of 2.5D, 3DIC and stacked die technologies
- Understanding of chip level CMOS design concepts desired
- Strong customer-facing communication and problem-solving skills
- Strong personal drive for continuous learning and expanding professional skill sets
- Excellent verbal and written communication skills
Benefits
- paid vacation and paid holidays
- 401(k) plan with employer match
- employee stock purchase plan
- a variety of medical, dental and vision plan options
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