Senior Packaging Engineer designing and developing advanced System-in-Package solutions for Littelfuse. Leading projects from materials selection to production ramp-up in a hybrid and collaborative environment.
Responsibilities
Architect and develop SiP solutions for solid-state control and protection systems
Perform stress and tolerance analyses; create detailed 3D models and engineering drawings
Evaluate and select materials including substrates, die attach, underfills, encapsulants, and thermal interface materials
Partner with cross-functional teams to assess technical feasibility and identify suitable suppliers
Work with contract manufacturers and internal teams to transition designs into production
Prepare and maintain comprehensive design documentation
Define and interpret multi-physics simulations (thermal, electrical, mechanical) to predict lifetime performance
Ensure designs meet performance, reliability, and cost targets through rigorous evaluation
Provide regular updates on project status, milestones, and deliverables
Support occasional travel to evaluate suppliers and assist with production ramp-up
Requirements
MS in Mechanical Engineering, Physics, or Materials Science (or BS with equivalent experience)
10+ years of hands-on experience in semiconductor IC packaging, with a focus on SiP development
Expertise in flip chip bonding, interposer design, and substrate layout
Strong understanding of thermal management, signal integrity, and power integrity in package design
Experience with high-voltage isolation techniques, reliability planning, and design for manufacturing
Entrepreneurial mindset with a willingness to experiment, take initiative, and navigate ambiguity
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