Hybrid Senior Packaging Engineer – System-In-Package

Posted 3 weeks ago

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About the role

  • Architect and develop SiP solutions for solid-state control and protection systems
  • Perform stress and tolerance analyses; create detailed 3D models and engineering drawings
  • Evaluate and select materials including substrates, die attach, underfills, encapsulants, and thermal interface materials
  • Partner with cross-functional teams to assess technical feasibility and identify suitable suppliers
  • Work with contract manufacturers and internal teams to transition designs into production
  • Prepare and maintain comprehensive design documentation
  • Define and interpret multi-physics simulations (thermal, electrical, mechanical) to predict lifetime performance
  • Ensure designs meet performance, reliability, and cost targets through rigorous evaluation
  • Provide regular updates on project status, milestones, and deliverables
  • Support occasional travel to evaluate suppliers and assist with production ramp-up

Requirements

  • MS in Mechanical Engineering, Physics, or Materials Science (or BS with equivalent experience)
  • 10+ years of hands-on experience in semiconductor IC packaging, with a focus on SiP development
  • Expertise in flip chip bonding, interposer design, and substrate layout
  • Strong understanding of thermal management, signal integrity, and power integrity in package design
  • Experience with high-voltage isolation techniques, reliability planning, and design for manufacturing
  • Entrepreneurial mindset with a willingness to experiment, take initiative, and navigate ambiguity

Benefits

  • Flexible work arrangements
  • Professional development opportunities

Job title

Senior Packaging Engineer – System-In-Package

Job type

Experience level

Senior

Salary

Not specified

Degree requirement

No Education Requirement

Location requirements

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