Packaging Engineer responsible for all packaging engineering activities at Kandou. Driving assembly manufacturing and ensuring quality standards for semiconductor products.
Responsibilities
Authority in all stages of assembly manufacturing
Promotion of Design for Manufacture (DFM) philosophy within Kandou Bus
Ownership of package technology selection and design in accordance with Kandou products requirements
Ownership of substrate design for substrate-based products e.g. TFBGA, LFBGA, FCCSP, etc.
Transfer of product performance, quality, and customer requirements into various design and or assembly specifications/procedures
Ownership of all packaging documentation/maintenance along with implementation of relevant specifications at Kandou’s packaging partners
Bring up and management of assembly partners in line with Kandou’s product realization process ensuring qualification, early volume, and sustaining engineering
Work with multi-functional groups including product design, engineering, and marketing to ensure our package technology requirements are fully supported by Kandou’s assembly partners.
Review package technology offerings and Kandou’s product requirements driving understanding and alignment with Kandou’s technology roadmap
Drive accountability and awareness, solve problems, remove roadblocks, and proactively search out and address risks or weaknesses to ensure new product requirements meet quality standards and NPI completes on time and within budget
Provide silicon leadership driving initiatives including time to market, yield, quality & cost
Specifies assembly/packaging partners
Improves assembly production performance through monthly metrics, quarterly business reviews and comprehensive supplier assessments
Prepares analysis presenting data analysis to management and customers where required
Assures supplier understanding of production requirements
Maintains required documentation and files
Requirements
+5 years semiconductor industry experience essential with knowledge of manufacturing processes, procedures, facilities and equipment
+5 years’ experience of working with fabless silicon operations
+5 years’ experience of working with outsourced assembly packaging partners
Strong diagnostic and analytical skills with excellent numerical ability
Advanced skills with all MS Office Products, especially Excel and PowerPoint
Spoken & written English proficiency is a must.
Good networking, negotiation and influencing skills.
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