Onsite Principal Engineer, Advanced Packaging, SI/PI

Posted 2 hours ago

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About the role

  • Advanced Packaging Engineer at Marvell responsible for SI/PI analysis and design optimization in high-performance computing and AI. Collaborating with design teams on complex power delivery networks and packaging technologies.

Responsibilities

  • SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
  • Interfacing with product design teams and clients for optimized floor-planning, package substrate design, and power delivery network design
  • Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
  • Training and mentoring within a growing team of Signal and Power Integrity engineers

Requirements

  • Bachelor’s degree in electrical engineering or related fields
  • 10+ years of related professional experience in package or PCB design or Master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 8+ years of experience
  • Understanding of signal integrity and power integrity concepts and fundamentals
  • Experience in package development, including interposer design
  • People management or technical leadership
  • Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
  • Experience with simulation and analysis using tools like PowerSI, SIwave
  • Working knowledge of circuit extractions and simulations

Benefits

  • flexible time off
  • 401k
  • year-end shutdown
  • floating holidays
  • paid time off to volunteer

Job title

Principal Engineer, Advanced Packaging, SI/PI

Job type

Experience level

Lead

Salary

$148,500 - $219,780 per year

Degree requirement

Bachelor's Degree

Tech skills

Location requirements

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