Advanced Packaging Engineer at Marvell responsible for SI/PI analysis and design optimization in high-performance computing and AI. Collaborating with design teams on complex power delivery networks and packaging technologies.
Responsibilities
SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
Interfacing with product design teams and clients for optimized floor-planning, package substrate design, and power delivery network design
Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
Training and mentoring within a growing team of Signal and Power Integrity engineers
Requirements
Bachelor’s degree in electrical engineering or related fields
10+ years of related professional experience in package or PCB design or Master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 8+ years of experience
Understanding of signal integrity and power integrity concepts and fundamentals
Experience in package development, including interposer design
People management or technical leadership
Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Experience with simulation and analysis using tools like PowerSI, SIwave
Working knowledge of circuit extractions and simulations
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