Solution Engineer II providing technical support for Onit's suite of products. Collaborating with various teams to troubleshoot and optimize solutions for clients in legal operations.
About the role
- Senior Technical Solutions Engineer at Intel Foundry Services managing customer success for advanced packaging and leading technical consultations. Working closely with internal teams and customers to drive engagement and solutions.
Responsibilities
- Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
- Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
- Partner directly with customers to understand packaging challenges and requirements
- Provide expert technical consultation on packaging solutions and processes
- Connect customers with Intel Foundry's technical experts for specialized insights
- Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
- Influence product and technology roadmaps through customer feedback and market insights
- Coordinate internal Intel resources to ensure customer success
- Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
- Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
- Track commitments, action items, and escalations while monitoring risks and dependencies
- Drive resolution of qualification and delivery issues
- Provide clear, regular status reports to customers and leadership
- Facilitate effective communication between technical and business stakeholders
Requirements
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
- 5+ years of experience in Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
- 8+ years of Semiconductor experience
- Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field (preferred)
- Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management (preferred)
- Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes (preferred)
- Experience with DOE, FMEA, yield analysis, and failure analysis methodologies (preferred)
- Project management and customer-facing experience (preferred)
- Flexibility for travel as needed (preferred)
Benefits
- Competitive pay
- Stock bonuses
- Health insurance
- Retirement plans
- Vacation
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