Leads complex cross-disciplinary initiatives in microsystems technology at Texas Institute for Electronics. Orchestrates collaboration across teams ensuring strategic alignment and timely execution.
Responsibilities
Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE’s advanced microsystems roadmap.
Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.
Serve as the central liaison between TIE’s technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators.
Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy.
Other related functions as assigned.
Requirements
For Senior Technical Program Manager: 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
For Principal Technical Program Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques.
Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows.
Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders.
Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to get the job done.
Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively.
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
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