About the role

  • Architect RF and mixed-signal microsystems operating across K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz) for high-performance, low-latency communication, radar, and sensing applications.
  • Define and drive RF front-end architectures, including LNAs, PAs, mixers, phase shifters, and T/R modules, optimized for 3.0D integration and advanced packaging flows.
  • Collaborate with device, packaging, and digital architects to achieve co-optimization of RF, thermal, and mechanical performance within heterogeneous multi-die systems.
  • Lead EM/circuit co-simulation and system-level modeling using tools such as HFSS, ADS, AWR, or CST to validate and tune design performance across process corners and temperature.
  • Oversee RF testing, characterization, and calibration at wafer, die, and module levels—developing test plans, de-embedding strategies, and measurement automation for K/W-band hardware.
  • Engage with foundry, EDA, and metrology partners to define design enablement requirements for next-generation RF packaging (e.g., hybrid bonding, AiP, glass/Si interposers).
  • Author technical documentation, reference designs, and design guidelines to accelerate ecosystem adoption of TIE’s 3.0D RF microsystems platform.
  • Other related functions as assigned.

Requirements

  • M.S. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design.
  • At least 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above).
  • Deep expertise in S-parameter characterization, on-wafer measurements, vector network analysis, and de-embedding methodologies.
  • Proficiency with RF simulation and design tools such as Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio, or equivalent.
  • Strong understanding of electromagnetic effects in packaging—signal integrity, coupling, and loss across interposers and redistribution layers.
  • Proven track record in RF testing automation, data analysis, and test correlation between EM models and measured results.
  • Ability to work cross-functionally with device, packaging, EDA, and system teams in a fast-moving R&D environment.

Benefits

  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
  • Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning plus professional conference opportunities
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Job title

Radio Frequency (RF) Architect

Job type

Experience level

SeniorLead

Salary

Not specified

Degree requirement

Postgraduate Degree

Location requirements

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