Hybrid Radio Frequency (RF) Architect

at The College of Education at The University of Texas at Austin

• Job title: Radio Frequency (RF) Architect
• Job type: Full Time
• Experience level: Senior, Lead
• Salary: Not specified
• Degree requirement: Postgraduate Degree
• Location requirements: Hybrid, Austin, United States

About the role

• RF Architect developing mixed-signal microsystems for communication, radar, and sensing applications. Working with innovative technologies at the Texas Institute for Electronics, ensuring performance in chip packaging.

Responsibilities

• Architect RF and mixed-signal microsystems operating across K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz) for high-performance, low-latency communication, radar, and sensing applications.
• Define and drive RF front-end architectures, including LNAs, PAs, mixers, phase shifters, and T/R modules, optimized for 3.0D integration and advanced packaging flows.
• Collaborate with device, packaging, and digital architects to achieve co-optimization of RF, thermal, and mechanical performance within heterogeneous multi-die systems.
• Lead EM/circuit co-simulation and system-level modeling using tools such as HFSS, ADS, AWR, or CST to validate and tune design performance across process corners and temperature.
• Oversee RF testing, characterization, and calibration at wafer, die, and module levels—developing test plans, de-embedding strategies, and measurement automation for K/W-band hardware.
• Engage with foundry, EDA, and metrology partners to define design enablement requirements for next-generation RF packaging (e.g., hybrid bonding, AiP, glass/Si interposers).
• Author technical documentation, reference designs, and design guidelines to accelerate ecosystem adoption of TIE’s 3.0D RF microsystems platform.
• Other related functions as assigned.

Requirements

• M.S. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design.
• At least 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above).
• Deep expertise in S-parameter characterization, on-wafer measurements, vector network analysis, and de-embedding methodologies.
• Proficiency with RF simulation and design tools such as Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio, or equivalent.
• Strong understanding of electromagnetic effects in packaging—signal integrity, coupling, and loss across interposers and redistribution layers.
• Proven track record in RF testing automation, data analysis, and test correlation between EM models and measured results.
• Ability to work cross-functionally with device, packaging, EDA, and system teams in a fast-moving R&D environment.

Benefits

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card