Project Development Engineer Intern supporting automation projects with Repair Engineering Groups at Teradyne. Collaborating on ongoing projects and developing engineering tools in Costa Rica.
About the role
- Senior RF Engineer leading design and development of imaging radars up to 81 GHz at Mobileye. Requires expertise in RF design and PCB development for advanced RF systems.
Responsibilities
- Lead the design and development of RF circuits and PCBs for mmWave applications up to 81 GHz.
- Assist in the antenna design and integration.
- Conduct full-wave and circuit-level RF simulations (HFSS, ADS etc.) to validate design performance.
- Optimize high-speed PCB layouts for minimal loss, crosstalk, and parasitics at mmWave frequencies.
- Define and execute test plans, including lab measurements, characterization, and validation of RF systems.
- Collaborate cross-functionally with hardware, digital, mechanical, and system engineering teams.
- Document design methodologies, test results, and provide technical reports for internal and external customers.
Requirements
- B.Sc. or M.Sc. in Electrical Engineering, RF/Microwave Engineering, or a related field.
- 8+ years of experience in RF design, with at least 3 years working in mmWave (60–100 GHz) domain.
- Strong experience with RF PCB design tools (Cadence Allegro/OrCAD).
- Proficiency with electromagnetic simulation tools (HFSS).
- Hands-on lab experience with VNA, spectrum analyzer, signal generators, and probe station measurements at mmWave frequencies.
- Deep knowledge of antenna theory and design, including beamforming and phased array systems.
- Solid understanding of RF link budget, impedance matching, and transmission line theory.
- Experience in high-volume product development is a plus (automotive radar, satellite, or similar applications).
- Excellent problem-solving, communication, and leadership skills.
- Experience with 81 GHz radar or communication systems - Advantage
- Knowledge of system-level architecture for phased arrays and MIMO systems - Advantage
- Familiarity with thermal and mechanical constraints in high-frequency designs - Advantage
- Background in RF packaging and integration (flip-chip, waveguide, transitions, etc.') - Advantage
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Location requirements
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