Packaging Engineer providing comprehensive package engineering support at Perrigo. Involves collaboration with teams to ensure effective packaging development and component maintenance.
About the role
- Analog Layout Engineer (Lead) specializing in custom layout and verification of high-speed circuits for chip-to-chip communication. Key responsibilities include collaborating with design teams and customer interactions.
Responsibilities
- Position in custom layout and verification of analog circuits, cells, blocks, and IP for multi-Gigabit high speed chip to chip communication links (SerDes up to and beyond 28Gb/s and/or memory IO) in advanced semiconductor technology nodes
- Layout and verification of very high-speed analog circuits
- Interact closely with the design team to understand requirements and implement solutions
- Support IP and chip level integration
- Support and interact with customers on requirements, and IP delivery
- Exposure to flip-chip package technologies
Requirements
- Must have experience in custom analog layout of circuits and blocks for multi-Gigabit serial data-link transceivers or HF/RF circuits
- Must have expertise in layout of high-speed /frequency circuits like amplifiers, oscillators, phase-locked loops, delay-locked loops, and other fundamental building blocks like biasing, buffers, regulators, filters, data converters, etc.
- Understanding of layout approaches and techniques for high-speed circuits, matching constraints, minimization of parasitics, power grids and ESD requirements
- Experience on modern semiconductor process technologies including 28nm, 14/16nm, 7nm
- User of EDA tool for design and verification like Cadence Virtuoso, Spectre/HSpice, Calibre/PVS DRC/LVS, parasitics extraction and modelling, EM, and IR drop, ESD, etc.
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Location requirements
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