Hybrid Photonics Hybrid Integration Engineer

at Nokia

• Job title: Photonics Hybrid Integration Engineer
• Job type: Full Time
• Experience level: Mid level, Senior
• Salary: $139,283 - $258,669 per year
• Degree requirement: Postgraduate Degree
• Tech skills: Assembly
• Location requirements: Hybrid, Sunnyvale, United States

About the role

• Photonics Hybrid Integration Engineer at Nokia integrating hybrid materials into Silicon Photonics platforms. Collaborating on advanced optical designs and managing manufacturing processes for high-performance modules.

Responsibilities

• Explore, define, and optimize next-generation wafer- and package-level fabrication processes for a high-performance Silicon photonics platforms, including hybrid/heterogeneous integration of exotic materials, using advanced packaging technologies.
• Lead the next generation hybrid silicon photonic design in collaboration with cross-functional teams, stakeholders and vendors to ensure package and performance requirements are met.
• Survey advanced Photonic solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Conduct root cause analysis and implement solutions to achieve high yield targets.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Requirements

• 3-5 years of experience in integrated photonics, semiconductors, or microelectronics fabrication.
• Expertise in Silicon photonics, TFLN, BTO, etc…
• Experience with wafer fab manufacturing processes, such as lithography, PVD/CVD/ALD, wet/dry etch, CMP.
• Experience with W2W and D2W bonding.
• Track record in developing and optimizing new nanofabrication processes.
• Strong problem-solving skills and ability to analyze complex data sets.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging, AFM, RI characterization.

Benefits

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program