Solutions Architect driving API standards and integration patterns for Zantech's DoD projects. Involving multi - cloud architecture and cross - domain solutions, ensuring secure data flows.
About the role
- Photonics Hybrid Integration Engineer at Nokia integrating hybrid materials into Silicon Photonics platforms. Collaborating on advanced optical designs and managing manufacturing processes for high-performance modules.
Responsibilities
- Explore, define, and optimize next-generation wafer- and package-level fabrication processes for a high-performance Silicon photonics platforms, including hybrid/heterogeneous integration of exotic materials, using advanced packaging technologies.
- Lead the next generation hybrid silicon photonic design in collaboration with cross-functional teams, stakeholders and vendors to ensure package and performance requirements are met.
- Survey advanced Photonic solutions, materials and vendors to stay current with new technological advancements.
- Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
- Drive package debug activities during product validation and qualification.
- Conduct root cause analysis and implement solutions to achieve high yield targets.
- Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.
Requirements
- 3-5 years of experience in integrated photonics, semiconductors, or microelectronics fabrication.
- Expertise in Silicon photonics, TFLN, BTO, etc…
- Experience with wafer fab manufacturing processes, such as lithography, PVD/CVD/ALD, wet/dry etch, CMP.
- Experience with W2W and D2W bonding.
- Track record in developing and optimizing new nanofabrication processes.
- Strong problem-solving skills and ability to analyze complex data sets.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
- Experience with package and process design/development from design to production.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging, AFM, RI characterization.
Benefits
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
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