Product Management Intern supporting planning and execution of product management activities for Two Wheeler segment at HARMAN. Gaining hands - on experience in development and implementation of connectivity products and technologies.
EI
Onsite Technical Package Product Manager – Member of Technical Staff
Posted 52 minutes ago
About the role
- Technical Package Product Manager at Micron enhancing DRAM product solutions for datacenters. Collaborating on IC package design and leading multi-functional teams to meet technical goals.
Responsibilities
- Collaborating with customers on their IC package product requirements and solutions.
- Defining test vehicles to deliver the vital advanced IC package design rules, new materials, and integrations.
- Providing consultation on IC package design, thermal, electrical, mechanical, reliability, and cost considerations.
- Working with a diverse multi-functional team in Micron.
- Contributing to the alignment between product market development, die and IC package design, and chip to package interactions.
- Engaging datacenter and business partners in systems requirements for end application and translating into package product technical requirements' definition (thermal, mechanical, reliability and aspects of electrical).
- Defining memory package design rule roadmap for wirebond and TSV stacked memory applications.
- Leading a design and development team for test vehicle definition and execution to achieve roadmap requirements and validation ahead of go-to-market product timelines.
- Collaborating with Business, Product Engineering and field teams to guide package products from concept to mass production.
Requirements
- Bachelor’s degree in physics, Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering; advanced degrees (MS, PhD) are preferred.
- 10+ years of proven experience in related fields.
- Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring.
- Proven leadership in leading multi-functional teams to achieve timely technical goals while maintaining a high standard of excellence.
- A keen understanding of IC packaged product solutions (TSV, Discrete, PoP, FOP, InFo, MEP) and the system integrations used in the top datacenter makers in the US.
- Excellent English interpersonal skills.
- Familiarity with datacenter company cultures.
- Skilled in interpreting sophisticated design and simulation data across multiple engineering domains.
Benefits
- Health insurance
- 401(k) matching
- Paid family leave
- Paid time-off program
- Paid holidays
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