Lead Engineer managing advanced semiconductor packaging programs at Micron. Collaborating cross-functionally to ensure compliance and operational excellence throughout project lifecycle.
Responsibilities
Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure.
Define project missions, objectives, key deliverables, and resource requirements.
Lead cross-functional teams across TD, HVM, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives.
Develop and implement standardized PMO methodologies, tools, and templates.
Own CapEx and OpEx planning, PTM and MOR management, and BOP design systems integration.
Ensure compliance with internal governance models and external customer requirements.
Align project goals with PDE’s mission to embed analytics and simulation into development workflows.
Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams.
Provide regular updates to leadership on project status, risks, and mitigation strategies.
Develop and track KPIs for project success, yield reporting, and EOL accountability.
Conduct project reviews to assess outcomes and identify lessons learned.
Mentor project managers and promote continuous improvement across PMO practices.
Requirements
Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field
8+ years of experience in semiconductor packaging, process integration, or technology development.
Proven track record in managing complex, cross-functional projects in a high-tech environment.
Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration.
Excellent communication, leadership, and stakeholder management skills.
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