Senior Software Engineer at Capital One collaborating across Agile teams to drive technological transformations. Focusing on full - stack development and delivering cloud - based solutions for financial empowerment.
About the role
- Senior Engineer at Qnity leading Copper Hybrid Bonding development for high-performance packaging. Collaborating on next-generation interconnect technologies with a focus on innovation and problem-solving.
Responsibilities
- Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration
- Define technical roadmap, milestones, and deliverables aligned with business objectives
- Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes
- Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB
- Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality
- Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology
- Act as the primary technical interface with customers to align bonding technology with product requirements
- Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering
- Identify opportunities for process differentiation and file patents to protect intellectual property
- Stay ahead of industry trends and benchmark against leading-edge CHB technologies
Requirements
- Master’s degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred
- Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred
- Experience and knowledge in semiconductor packaging or interconnect technology development required
- Proven expertise in grain engineering, copper bonding, and hybrid bonding processes
- Hands-on experience with electrochemical deposition, CMP, and surface activation techniques
- Strong analytical and problem-solving skills
- Familiarity with reliability testing and failure analysis for bonded interfaces
Benefits
- Comprehensive pay and benefits package
- Equal opportunity employer
Job title
Job type
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Not specified
Degree requirement
Location requirements
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