Senior Systems Engineer in Professional Services at Datacom, working directly with enterprise customers. Delivering IT infrastructure projects with a focus on collaboration and customer engagement.
About the role
- Yield Systems Engineer developing yield analysis software solutions for Intel's advanced packaging roadmap. Collaborating with partners and leading projects in defect data and yield analysis.
Responsibilities
- Adapt, develop, deploy and sustain yield analysis software solutions
- Drive aspects of Advanced Packaging's inline defect data pipeline workflows
- Work closely with partners from automation, metrology, yield/defmet and manufacturing on requirements, enabling, testing and debugging
- Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions
- Lead enabling / debugging projects, role modeling effective problem solving
- Demonstrate a strong sense of ownership and quality to drive for mutually effective solutions
Requirements
- Possess a Bachelor's Degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any related technical discipline with 3+ years of relevant experience -OR- Master's degree with 2+ years -OR- PhD degree with 1+ year
- Experience in Python or comparable programming language
- Strong problem-solving and teamwork skills
- Experience with Intel's wafer defect metrology and analysis ecosystem
- Previous related work experience in a semiconductor foundry (preferred)
- Experience with Industry standard Defect and Yield Analysis applications like Klarity or Exensio
- Yield improvement or defect metrology / defect reduction experience
- Experience with ADC (Automated Defect Classification) and Machine Learning / AI
- Experience with modern distributed version control systems, particularly Git, GitLab, or GitHub
Benefits
- Competitive pay
- Stock bonuses
- Health insurance
- Retirement plans
- Vacation
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