Mechanical Engineer designing and optimizing automated systems for healthcare waste management at a global leader in sustainability. Collaborating on advanced technology projects in healthcare waste services.
About the role
- Mechanical Engineer developing Multiphysics thermo-mechanical simulations for semiconductor packaging at Intel. Collaborating on design and development across multiple engineering teams in the semiconductor field.
Responsibilities
- developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry.
- developing and validating finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
- performing simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
- collaborating with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
- designing and coordinating lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
- driving strategic development activities and working closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
Requirements
- Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 2+ years of relevant experience -OR- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
- Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
- Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
- Experience with designing, planning and executing experiments, along with interpretation of results.
- Experience with scripting and automation (e.g., Python, TCL, MATLAB)
- Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
- Programming/script development with artificial intelligence and machine learning concepts.
- Previous related work experience in a semiconductor foundry preferred.
Benefits
- competitive pay
- stock bonuses
- benefit programs which include health, retirement, and vacation.
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