Product Engineer providing expertise for software used in Emerson's AMS portfolio. Working with customers to diagnose issues and enhance products in industrial automation.
About the role
- Lead Engineer for high-end electronic cooling solutions in AI servers and switches. Collaborate with hardware and thermal architects to design cutting-edge products.
Responsibilities
- Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision until transfer to manufacturing.
- Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility
- Maintain awareness of heat transfer hardware
- Conceive and implement ways to enhance and extend operation of heat transfer hardware
- Apply best-in-class fluid flow geometry and technology to cool high heat flux chips
- Document thermal test plans and analyze test data
Requirements
- 4 to 6 years in a similar role or industry
- Relevant coursework in heat transfer and fluid mechanics
- Familiarity with 3D software applications
- BA or MBA degree in Engineering with preference for Master’s degree in Thermodynamic Engineering
Benefits
- Health insurance
- 401(k) matching
- Flexible work hours
- Paid time off
- Professional development
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Tech skills
Location requirements
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