RF Lead designing and developing RF/Microwave Wireless products in a team environment. Overseeing board-level and sub-system level designs with experience in Telecom RF design.
Responsibilities
RF Lead will be part of the team and contribute to Board-level and sub-system level design & development for RF/Microwave Wireless products.
This role is expected to independently perform and lead the team for delivering Board-level and sub-system design, schematic/layout and block-level line-up support.
Experience using appropriate tools and T&M instruments as well as detailed test reports generation, and other artifacts ownership for technical documentation and presentation.
Individuals should also be capable of handling contemporary design architecture including in-house/or OEM proprietary suggested Reference boards.
Requirements
M.Tech/B.Tech./B.E. in Engineering (Electronics & Comm/Electrical & Electronics/other relevant domains)
10 to 15 years of experience in Telecom RF design and development.
RF block-level design, System level characterization for Stability, Noise Figure (NF), Gain & Linearity (P1dB), Intermods (IM3/IIP3), ACLPR, EVM, CCDF, Rx. Sensitivity, Thermal Chamber Testing and S-parameter characterization.
3GPP TS Series 36/37/38 and O-RAN qualification fundamentals for 5G-NR and NGN products.
Able to independently work on Design & product qualification documentation, and component qualification for power derating related analysis etc.
Prepare and support system specifications, test procedures and technical write-ups.
DVT, SVT, RCT and End-to-End testing for RF/Wireless products using Keysight, R&S and Anritsu T&M (VSG/VSA/VNA and Samling Oscilloscopes etc.) including O-RAN Studio, MIMO suites etc.
Assist in TX/RX line-up calculations and other RF Active/Passive components (Duplexers/Filters, Power Dividers/ Combiners, Switches, Directional Couplers, and Attenuators/Splitters etc.) testing and validate to verify regulatory and performance targets.
Collaborate with senior engineers/SME on RF design, testing and performance KPIs.
Product Engineer providing expertise for software used in Emerson's AMS portfolio. Working with customers to diagnose issues and enhance products in industrial automation.
Sr. Principal Software Engineer at Mastercard focusing on innovative AI & Data Platform architecture. Leading enterprise - scale initiatives and engineering excellence across multiple services and applications.
Vice President of Software Engineering leading architecture and modernization of Mastercard’s Decision Management Platform. Collaborating with cross - functional executives to enhance AI - driven decision - making.
Engineering Lead guiding the technology team at Coles Group to deliver impactful software solutions. Managing projects and mentoring engineers, leveraging modern technologies and data sets.
Senior Full Stack Engineer at GEICO developing high - performance distributed systems and applications. Collaborating across teams and mentoring junior engineers in a hybrid work environment.
Software Engineering Intern focusing on machine learning systems and training infrastructure at Woven by Toyota. Collaborating on crucial ML projects to enhance mobility technology.
Software Engineer developing next - generation wire payment processing platform at Bank of America. Leading cross - functional teams in delivering high - impact features with modern technologies and payment systems.
Software Engineer responsible for developing wire payment processing platform with leadership and hands - on development. Leading teams through technical challenges in a growing fintech environment.
Softwareentwickler developing software solutions for the social economy with focus on ERP systems and cloud components. Join an agile team dedicated to enhancing social services through technology.
Software Developer contributing to the development of innovative network structures for MERKUR GROUP. Involves creating user - friendly interfaces and managing security systems.