Onsite MTS 3D Heterogeneous Integration Engineer

Posted 8 hours ago

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About the role

  • R&D Engineer leading advanced 3D Heterogeneous Integration initiatives for GlobalFoundries. Focused on process development and collaboration for advanced packaging solutions in semiconductor manufacturing.

Responsibilities

  • Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines.
  • Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
  • Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
  • Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
  • Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
  • Drive data analysis, interpretation of results, and understanding of failure modes.
  • Identify and resolve process integration issues and related challenges.
  • Generate IP related to novel wafer integration and packaging technology.

Requirements

  • Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 5-6 years of prior related work experience.
  • In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
  • Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).

Benefits

  • Health insurance
  • Retirement plans
  • Professional development opportunities
  • Paid time off
  • Flexible work hours

Job title

MTS 3D Heterogeneous Integration Engineer

Job type

Experience level

Mid levelSenior

Salary

$98,000 - $176,000 per year

Degree requirement

Postgraduate Degree

Tech skills

Location requirements

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