R&D Engineer leading advanced 3D Heterogeneous Integration initiatives for GlobalFoundries. Focused on process development and collaboration for advanced packaging solutions in semiconductor manufacturing.
Responsibilities
Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines.
Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
Drive data analysis, interpretation of results, and understanding of failure modes.
Identify and resolve process integration issues and related challenges.
Generate IP related to novel wafer integration and packaging technology.
Requirements
Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
MS degree with at least 5-6 years of prior related work experience.
In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
Must have at least an overall 3.0 GPA and proven good academic standing.
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