Designer in Pets at Home's creative team, crafting marketing materials across digital and print. Collaborating with cross - functional teams to deliver high - quality designs while staying updated on trends.
About the role
- IC Packaging Engineer responsible for next-generation package architecture and design solutions. Collaborating with cross-functional teams to ensure optimal performance and reliability in semiconductor applications.
Responsibilities
- Collaborate with chip design and analog/digital IP/PHY teams to optimize chip floorplan, die bump patterns, and IO architecture for advanced node products.
- Co-optimize package stack-up, layer count, escape routing, BGA pattern, and power integrity architecture aligned to system and manufacturing requirements.
- Interpret SI/PI parameters (RL, IL, NEXT/FEXT, etc.) to drive signal integrity optimization.
- Work with IC design, system engineering, SI/PI, and thermal teams to perform BGA substrate design using Cadence APD or equivalent tools.
- Ensure package designs meet SI/PI, mechanical, high-power thermal and reliability targets.
- Define and refine assembly BOM, process flows, and design rules for advanced packaging technologies.
- Define POR for new silicon nodes including bump metallization, geometry, and process requirements.
- Drive implementation, optimization, and HVM qualification of new package / assembly technologies.
- Own packaging deliverables from concept through substrate design, development, qualification, and high-volume manufacturing.
- Lead interactions with assembly, substrate, and manufacturing partners for NPI bring-up and production ramp.
- Provide sustaining support during HVM, including multi-source enablement.
- Work closely with QA, product/test engineering, and customer teams to diagnose and resolve quality, reliability, or manufacturing issues.
Requirements
- Bachelors and 8+ years or Masters degree and 6+ years or PhD and 3+ years of related experience
- BS/MS/PhD in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or related field.
- Extensive hands-on experience in advanced IC packaging for advanced silicon nodes.
- Expertise in substrate design, SI/PI principles, thermal management, and high-speed IO packaging.
- Strong understanding of high layer count, large body, flip chip BGA packaging technology
- Proficiency in Cadence Allegro APD/SIP or comparable packaging design tools.
- Experience working with global OSATs and substrate suppliers.
- Proven ability to drive NPI through HVM with strong cross-functional leadership.
- Excellent communication, documentation, and customer-facing skills.
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
Job title
Job type
Experience level
Salary
Degree requirement
Tech skills
Location requirements
Supervising staff for customer consultation and project management in new business areas. Collaborating across departments to maintain customer satisfaction and deliver projects efficiently.
Senior Designer creating designs for fashion in a pioneering footwear company. Developing print ideas and collaborating on style - related projects.
Senior Footwear Designer leading creative product development and brand vision at Group S2. Responsible for mentoring and collaborating with cross - functional teams to align strategies.
Designer de Conteúdo na Páprica, colaborando na criação de conteúdos visuais digitais e campanhas online. Trabalho híbrido em Curitiba com foco em aprendizado contínuo.
Power Intern at pSemi assisting engineers in the design and testing of power semiconductor products. Collaborating through product life cycle, from definition to release.
Telecom Project Designer creating outside plant telecommunications designs for connectivity across Canada. Collaborating with teams to deliver innovative solutions and achieve project success.
Fire Sprinkler Designer creating automatic sprinkler systems for fire protection projects. Collaborating on project execution and mentoring less experienced designers in a supportive team environment.
Fire Sprinkler Designer utilizing AutoCAD and AutoSprink for fire protection projects. Planning and executing design tasks while coordinating with project managers for success.
Technical Designer responsible for maintaining technical documentation and supporting strategic direction at Novonesis. Involves 2D drafting in AutoCAD and quality assurance of documentation processes.