Entry-level Process Development Engineer responsible for developing pretreatment processes in hybrid bonding. Working at Applied Materials, a leader in materials engineering solutions for chips and displays.
Responsibilities
Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications
Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking
Proactively initiate and conduct CnF tests to define process & hardware requirements
Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM
Deep dive with engineering team and/or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements
Evaluate proto chamber for hybrid bonding process for HBM
Own process optimization and drive engineering improvement
Guide account/field teams on tough technical issues
Requirements
Engineering or science university educational background
Academic background on plasma, wet clean, and/or thermal module is a big plus
Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus
10% travel commitment to the US, Taiwan, Korea or Europe
Benefits
Supportive work culture that encourages to learn, develop, and grow career
Programs and support for personal and professional growth
Health and wellbeing programs
Job title
Bonding Technology Process Development Engineer, Entry-level
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