Onsite Bonding Technology Process Development Engineer, Entry-level

Posted 1 hour ago

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About the role

  • Entry-level Process Development Engineer responsible for developing pretreatment processes in hybrid bonding. Working at Applied Materials, a leader in materials engineering solutions for chips and displays.

Responsibilities

  • Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications
  • Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking
  • Proactively initiate and conduct CnF tests to define process & hardware requirements
  • Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM
  • Deep dive with engineering team and/or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements
  • Evaluate proto chamber for hybrid bonding process for HBM
  • Own process optimization and drive engineering improvement
  • Guide account/field teams on tough technical issues

Requirements

  • Engineering or science university educational background
  • Academic background on plasma, wet clean, and/or thermal module is a big plus
  • Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus
  • 10% travel commitment to the US, Taiwan, Korea or Europe

Benefits

  • Supportive work culture that encourages to learn, develop, and grow career
  • Programs and support for personal and professional growth
  • Health and wellbeing programs

Job title

Bonding Technology Process Development Engineer, Entry-level

Job type

Experience level

Entry level

Salary

Not specified

Degree requirement

Bachelor's Degree

Location requirements

OnsiteSingapore

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