Hybrid Electronics Parts, Materials, and Processes Engineer – Advanced Packaging

Posted 5 hours ago

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About the role

  • Electronics Parts, Materials, and Processes Engineer supporting advanced semiconductor packaging for aerospace systems. Leading PM&P program management and collaboration with industry partners.

Responsibilities

  • Supporting parts, materials, and processes (PM&P) program management functions which include – PM&P selection commensurate with application risk tolerance, control boards, design reviews, and manufacturing readiness reviews
  • Provide ongoing technical consultation and advice to management, internal/external customers, and contractors on the evaluation, selection, and use of advanced semiconductor packaging (e.g., 2.5/3D, system in package, multi-chip module) for space and missile applications
  • May lead cross-organizational teams and organize interfaces within department
  • Collaborate with industry colleagues, and component supplier personnel to create/ maintain guidance and requirements related to selection, screening, qualification, and root cause failure analysis
  • Act as organization’s designated representative at technical meetings, presentation, and workshops
  • Mentor less experienced staff – as required – and serve as role model

Requirements

  • Bachelor’s degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline
  • At least eight years of increasingly responsible and related engineering/scientific experience (time spent obtaining advanced degree counts towards this).
  • Proficiency in industry PMP requirements standards development for advanced semiconductor packaging – including related, component selection, assembly materials, and processes (PMP), and selection of elements
  • Experience supporting parts, materials, and processes (PM&P) program management functions which include -- control boards, design reviews, and manufacturing readiness reviews
  • Excellent record of customer communication and interaction
  • Willingness to travel [domestically/internationally] approx. 25% of time
  • This position requires ability to obtain and maintain a TS/SSBI security clearance, which is issued by the US government. U.S citizenship is required to obtain a security clearance.

Benefits

  • Comprehensive health care and wellness plans
  • Paid holidays, sick time, and vacation
  • Standard and alternate work schedules, including telework options
  • 401(k) Plan — Employees receive a total company-paid benefit of 8%, 10%, or 12% of eligible compensation based on years of service and matching contributions; employees are immediately eligible and vested in the plan upon hire
  • Flexible spending accounts
  • Variable pay program for exceptional contributions
  • Relocation assistance
  • Professional growth and development programs to help advance your career
  • Education assistance programs
  • An inclusive work environment built on teamwork, flexibility, and respect

Job title

Electronics Parts, Materials, and Processes Engineer – Advanced Packaging

Job type

Experience level

SeniorLead

Salary

$117,300 - $175,900 per year

Degree requirement

Bachelor's Degree

Location requirements

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