Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving.
Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
Develop and deploy advanced design rules into next generation products.
Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products.
Requirements
BS degree or higher in Engineering or Material Science
Industry knowledge and experience of semiconductor packaging technologies
Background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages
Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
Understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D)
Experience with Program Management Methodology.
Benefits
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants.
Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.
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