Quantum Applications Engineer developing quantum algorithms and applications, mapping them to Atom Computing hardware. Collaborating with partners to advance quantum computing solutions.
About the role
- Process Integration Expert at Nearfield Instruments applying expertise in CMP, advanced packaging, and hybrid bonding. Collaborating with researchers and partners to develop innovative metrology solutions.
Responsibilities
- Apply deep process expertise in CMP, packaging, and bonding to define requirements for advanced metrology solutions.
- Translate challenges such as planarization (CMP), interconnect scaling (packaging), and bonding interface quality (hybrid bonding) into measurable metrology targets.
- Collaborate with system architects, AFM/optical experts, and computational scientists to design metrology approaches that tackle high-aspect ratio structures, alignment, dishing/erosion, voids, warpage, and interface defectivity.
- Work closely with leading semiconductor fabs and packaging partners to validate metrology concepts in real-world manufacturing.
- Act as the in-house process integration expert, bridging the gap between semiconductor manufacturing processes and next-generation metrology.
Requirements
- PhD or MSc in Materials Science, Physics, Mechanical/Electrical/Chemical Engineering, or related field.
- Proven expertise in at least two of the following areas (ideally all three): CMP (Chemical Mechanical Polishing) – planarization, defectivity, dishing, erosion.
- Advanced Packaging – 2.5D/3D integration, chiplets, interposers, TSVs, reliability.
- Hybrid Bonding – wafer-to-wafer and die-to-wafer bonding, overlay, bonding interface quality.
- 8+ years of relevant R&D or industry experience in preferably manufacturing side, or alternatively from the equipment side.
- Strong ability to translate process knowledge into metrology and process control requirements.
- Collaborative mindset and ability to operate across disciplines in a dynamic scale-up environment.
Benefits
- Competitive salary
- 30 Holidays
- Pension plan
- Holiday allowance
- Innovation with passion
- 43+ Nationalities
- Growing together
- Travel the world
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Location requirements
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