Technical Contact for Test and Design engineers at Tenneco translating customer requirements into product requirements. Leading projects from start through product launch while ensuring compliance with safety requirements.
About the role
- Process Integration Expert at Nearfield Instruments applying expertise in CMP, advanced packaging, and hybrid bonding. Collaborating with researchers and partners to develop innovative metrology solutions.
Responsibilities
- Apply deep process expertise in CMP, packaging, and bonding to define requirements for advanced metrology solutions.
- Translate challenges such as planarization (CMP), interconnect scaling (packaging), and bonding interface quality (hybrid bonding) into measurable metrology targets.
- Collaborate with system architects, AFM/optical experts, and computational scientists to design metrology approaches that tackle high-aspect ratio structures, alignment, dishing/erosion, voids, warpage, and interface defectivity.
- Work closely with leading semiconductor fabs and packaging partners to validate metrology concepts in real-world manufacturing.
- Act as the in-house process integration expert, bridging the gap between semiconductor manufacturing processes and next-generation metrology.
Requirements
- PhD or MSc in Materials Science, Physics, Mechanical/Electrical/Chemical Engineering, or related field.
- Proven expertise in at least two of the following areas (ideally all three): CMP (Chemical Mechanical Polishing) – planarization, defectivity, dishing, erosion.
- Advanced Packaging – 2.5D/3D integration, chiplets, interposers, TSVs, reliability.
- Hybrid Bonding – wafer-to-wafer and die-to-wafer bonding, overlay, bonding interface quality.
- 8+ years of relevant R&D or industry experience in preferably manufacturing side, or alternatively from the equipment side.
- Strong ability to translate process knowledge into metrology and process control requirements.
- Collaborative mindset and ability to operate across disciplines in a dynamic scale-up environment.
Benefits
- Competitive salary
- 30 Holidays
- Pension plan
- Holiday allowance
- Innovation with passion
- 43+ Nationalities
- Growing together
- Travel the world
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Location requirements
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