Manufacturing Sustaining Engineer supporting back-end semiconductor package solutions at pSemi Corporation. Collaborating with internal teams and offshore partners to meet performance and reliability requirements.
Responsibilities
Define and approve supplier qualification plans; evaluate and onboard new OSAT capabilities.
Benchmark industry technologies and recommend adoption roadmaps for capability gaps.
Launch NPI packages into volume production; ensure compliance with GMP and qualification deliverables.
Analyze complex failure modes and lead cross-functional 8D/root‑cause investigations to closure.
Mentor engineers; review and approve work products and technical documentation.
Partner with NPI Packaging to co‑optimize die‑package interactions for volume manufacturing.
Implement process control plans and SPC limits; establish robust qualification and release criteria.
Negotiate technical requirements, schedules, and risks with external partners and critical suppliers.
Coordinate with NPI Packaging for advanced packaging solutions (e.g., flip‑chip, SiP, laminate substrates) aligned to product roadmaps.
Requirements
8+ years related experience (or 6+ with Master’s; or PhD with 3+ years) in advanced packaging.
Ability to define standards and approve technical documentation.
Deep knowledge of IC package design and processes.
Effective mentoring and development of other engineers.
Proficiency establishing control plans, qualification protocols, and release criteria.
Strong negotiation and risk management with external partners.
Supplier evaluation and qualification experience; ability to assess and onboard new capabilities.
Track record leading complex NPI package introductions into production.
Benefits
pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees.
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