OS Kernel Engineer optimizing Windows OS and enabling new technologies for Intel's hardware. Collaborating with engineering teams to ensure high performance and reliability across client and server environments.
About the role
- Sr. Staff Thermal Engineer developing next-generation cooling technologies for high-power semiconductors. Collaborating with cross-functional teams for thermal solutions and mechanical designs at Marvell.
Responsibilities
- Conduct feasibility modeling for next-generation cooling technologies, including phase-change systems, evaporative solutions, and immersion concepts.
- Evaluate early-stage cooling architectures in collaboration with silicon, mechanical, and test engineering teams.
- Perform thermal interface material (TIM) scouting, comparative research, and preliminary characterization.
- Translate future product power-density roadmaps into cooling performance requirements for early design phases.
- Lead end-to-end thermal and mechanical design of cooling assemblies, including thermal heads, manifolds, sockets, and fluid delivery structures.
- Execute full 3D thermal simulations, conjugate heat-transfer analysis, and transient thermal modeling to predict evaporator and cold-plate performance.
- Develop and validate TIM analysis.
- Own material selection and fluid-path design for high-flow cooling systems, ensuring stability, reliability, and manufacturability.
- Validate integrated thermal head + socket assemblies in the lab, including structural, thermal, and reliability characterization.
- Build reliability prediction models for thermal cycling, material fatigue, creep, and long-term system behavior.
- Develop multi-zone thermal control concepts, including sensor strategy, PID algorithm design, loop-tuning, and control-firmware interaction.
- Own TIM qualification workflows including thermal resistance measurement, mechanical endurance, and process compliance.
- Script automation sequences for calibration, system setup, thermal control routines, and ATE/handler interaction.
- Work closely with handler engineering teams to ensure seamless integration of thermal heads into ATE/SLT.
- Partner with silicon architects, packaging engineers, and electrical/mechanical design teams to ensure cooling compatibility and design alignment.
- Collaborate with reliability, manufacturing, and test engineering teams to define qualification plans and production-readiness criteria.
- Interface with external vendors for thermal head manufacturing, fluid system components, TIM suppliers, and advanced materials.
Requirements
- Bachelor’s degree in Mechanical Engineering, Thermal Engineering, Chemical Engineering, or related field and 5+ years of related professional experience OR Master’s degree and/or PhD in Mechanical Engineering, Thermal Engineering, Chemical Engineering, or related field (Preferred) with 3+ years of experience.
- 3+ years of experience in thermal design, cooling systems, or mechanical systems for semiconductors, data centers, or high-power electronics.
- Proficiency with thermal simulation tools (One or more of: Flotherm, Icepak, COMSOL, Ansys, FloEFD, or equivalent).
- Strong knowledge of heat transfer, fluid dynamics, TIMs, and mechanical stress analysis.
- Hands-on experience validating thermal hardware in a lab environment.
- Experience with phase-change cooling, cold-plate design, or evaporative cooling systems.
- Familiarity with high-power device testing, thermal heads, or semiconductor handlers.
Benefits
- Employee stock purchase plan with a 2-year look back
- Family support programs to help balance work and home life
- Robust mental health resources to prioritize emotional well-being
- Recognition and service awards to celebrate contributions and milestones
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