Senior Engineer designing and delivering photonic integrated circuits at Infleqtion. Collaborating with teams to ensure high-performance designs and rapid experimental feedback.
Responsibilities
Own and deliver high-performance photonic component designs and PIC layouts that meet aggressive specs (loss, bandwidth, phase stability, power handling, crosstalk, yield).
Close the loop with the lab: define test plans, review data, troubleshoot discrepancies, and translate measurements into actionable design improvements.
Collaborate across teams to ensure PIC-level design choices support system-level performance, reliability, and manufacturability.
Requirements
M.S. or Ph.D. in Electrical Engineering, Applied Physics, Photonics, or a related field (or equivalent practical experience).
[4]+ years of relevant experience designing integrated photonics (Si, SiN, InP, or related platforms) with demonstrated taped-out designs or comparable project outcomes.
Advanced proficiency in photonics simulation and modeling (e.g., EME, FDTD, FEM, BPM, eigenmode, circuit-level/Interconnect modeling) and comfort validating models against measurement.
Hands-on experience with photonic layout and verification (PDK usage, hierarchy management, mask/tapeout deliverables).
Proficiency with Python for design automation, analysis, and workflow tooling; comfort working with version control (Git).
Practical experimental familiarity: common optical test equipment and techniques (fiber coupling/alignment, insertion loss, spectrum analysis, polarization handling, interferometric/phase-sensitive measurements, basic RF/optical modulation measurements).
**We Highly Value:**
Multiple tapeouts at commercial foundries, including direct foundry interface and post-silicon debug.
Experience with common photonics toolchains (e.g., Lumerical, Synopsys, COMSOL) and layout stacks (e.g., KLayout, gdsfactory).
Experience designing PIC-based laser subsystems (hybrid/heterogeneous gain integration), micro-combs, narrow-linewidth sources, or frequency control photonics.
Familiarity with photonic packaging constraints (edge/vertical coupling, alignment tolerances, thermal effects) and how they feed back into PIC design.
Strong communication and presentation skills; ability to work effectively with external partners (foundries, packaging, vendors).
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