Hybrid IC Package Layout Engineer

Posted 1 hour ago

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About the role

  • Lead engineer in package design process, driving the evolution of high-performance networking technologies at Cisco. Collaborate with cross-functional teams on ASIC package solutions.

Responsibilities

  • Be part of package design tasks, planning and driving schedules from concept through implementation
  • Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
  • Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency
  • Work closely with layout editors to deliver high-quality package designs aligned with interface requirements
  • Enhance design methodologies and partner with vendors to improve product quality and efficiency
  • Drive innovation in package solutions for Cisco’s next-generation ASICs

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering or a related field
  • Strong understanding of high-speed signal design, power distribution networks (PDN), and PCB design
  • Experience with industry-standard EDA tools for layout and design
  • Experience in ASIC package design, including pinout optimization and high-speed routing
  • Knowledge of silicon floor planning, SI, and PI considerations
  • Proven ability to lead design improvements and coordinate with stakeholders
  • Firsthand experience with testing and measurement equipment (oscilloscopes, TDR/VNA analyzers)
  • Excellent verbal and written communication skills in English
  • Scripting experience (Python, Perl, TCL, shell programming) is highly valuable.

Benefits

  • Flexible work arrangements
  • Professional development opportunities

Job title

IC Package Layout Engineer

Job type

Experience level

Mid levelSenior

Salary

Not specified

Degree requirement

Bachelor's Degree

Tech skills

Location requirements

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