Solution Architect responsible for designing architectural solutions in R&D at Hempel. Overseeing digital platforms and ensuring compliance with enterprise standards.
About the role
- Process Integration Engineer developing and advising on new semiconductor packaging modules at Applied Materials. Working in Albany, NY or Santa Clara, CA with diverse global teams.
Responsibilities
- Developing new modules leveraging Applied’s wide equipment portfolio
- Advising on equipment requirements for Advanced semiconductor packaging
- Acting as engineering expert in semiconductor packaging
- Driving cross functional projects
Requirements
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 10 years of experience in semiconductor packaging development and manufacturing
- Strong communication skills
- Ability to drive new materials and process development
- Domain expertise in advanced packaging areas
Benefits
- Supportive work culture
- Health and wellbeing programs
- Professional growth opportunities
- Potential bonuses and stock options
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