Device Technologist role at Intel, focusing on CMOS technologies for high performance manufacturing and collaboration with global teams.
About the role
- Packaging Development Engineer leading next generation Silicon Photonics package design at Nokia. Collaborating with cross-functional teams to optimize electrical assembly and develop advanced packaging solutions.
Responsibilities
- Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
- Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo compression bonding, underfill, hot bar soldering, etc…
- Optimize the assembly of electrical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
- Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
- Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
- Drive package debug activities during product validation and qualification.
- Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.
Requirements
- 4 -5 years of experience. Experience in high-speed electronics and Silicon Photnics package design.
- Experience with flip chip, fanout, thermo compression bonding, underfill, hot bar soldering. Experience in microelectronics, optoelectronics packaging design and assembly.
- Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
- Experience with package and process design/development from design to production.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
Benefits
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Tech skills
Location requirements
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