Hybrid Packaging Development Engineer

Posted 3 weeks ago

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About the role

  • Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
  • Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo compression bonding, underfill, hot bar soldering, etc…
  • Optimize the assembly of electrical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
  • Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
  • Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
  • Drive package debug activities during product validation and qualification.
  • Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Requirements

  • 4 -5 years of experience. Experience in high-speed electronics and Silicon Photnics package design.
  • Experience with flip chip, fanout, thermo compression bonding, underfill, hot bar soldering. Experience in microelectronics, optoelectronics packaging design and assembly.
  • Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
  • Experience with package and process design/development from design to production.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.

Benefits

  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability, and long-term disability
  • Life insurance, and AD&D – Company paid 2x base pay
  • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
  • Paid time off for holidays and Vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program/Work Life Resource Program

Job title

Packaging Development Engineer

Job type

Experience level

Mid levelSenior

Salary

Not specified

Degree requirement

Postgraduate Degree

Tech skills

Location requirements

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