Hybrid PCB Design Engineer, Level 5

at Snap Inc.

• Job title: PCB Design Engineer, Level 5
• Job type: Full Time
• Experience level: Senior, Lead
• Salary: $190,000 - $284,000 per year
• Degree requirement: Bachelor's Degree
• Tech skills: Assembly
• Location requirements: Hybrid, Palo Alto, United States

About the role

• Senior PCB Designer creating high density flex and printed circuit board designs at Snap Inc. Collaborating with engineers from prototype to mass production.

Responsibilities

• Work closely with electrical, mechanical, and manufacturing engineers to produce industry leading flexes and printed circuit board (PCB) designs from prototype through mass production using Allegro PCB Designer.
• Design high density PCBs, flexes, and rigid flexes requiring the use of stacked microvias, sequential lamination stack-ups, and fine pitch packages.
• Create fabrication and assembly drawings.
• Define design rules, apply them to the constraint manager, design within limits, create artworks, fabrication and assembly documentation, and verify designs prior to release.
• Collaborate with suppliers on stackups, capabilities, and solving engineering issues.
• Manage external ECAD resources as needed.
• Review Gerber/ODB++ data to ensure quality of design release.
• Drive simultaneous development of multiple challenging, complex PCB designs to meet critical program deadlines.

Requirements

• 7+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs
• Master’s degree in a technical field + 6+ years of post-grad experience
• PhD in a relevant technical field + 3+ years of post-grad experience
• Experience developing consumer electronic devices at production scale
• Experience routing impedance controlled nets, including differential pairs, per engineer’s instructions and component specifications
• Strong skills in designing quality multi-layer, high density designs with careful consideration of analog, RF, high speed, and/or power circuits
• Demonstrated understanding of IPC, Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT)
• Knowledge of PCB design standards for common interfaces in consumer products such as USB, PCIE, CSI, MIPI, and WIFI
• Experience with best practices for system integration and layout verification including mating of multiple boards (pin 1 verification methods, system level high speed length matching) and mechanical interference checks.
• Experience with one or more of the following: Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets, PCB ECAD Library creation and management, and/or script/automation creation.

Benefits

• paid parental leave
• comprehensive medical coverage
• emotional and mental health support programs
• compensation packages that let you share in Snap’s long-term success!