Software Engineering Manager overseeing Data Platform delivery with a focus on mentoring engineers at U.S. Bank. Responsible for cross - team alignment and technical solution delivery in fintech.
About the role
- Manufacturing Engineering Director leading production engineering teams for semiconductor products across OSAT partners. Ensuring quality, performance, and process improvements in assembly and testing operations.
Responsibilities
- Lead the strategic direction and operational execution of all assembly and test engineering sustaining activities across outsourced semiconductor assembly and test (OSAT) partner network.
- Establish and maintain strategic technical relationships with executive and engineering leadership at key OSAT partners.
- Drive OSAT performance through regular business reviews, KPI tracking, and accountability for quality, yield, delivery, and cost metrics.
- Coordinate multi-site manufacturing strategies to optimize capacity utilization, cost, and risk mitigation.
- Develop long-term manufacturing capacity and capability strategies aligned with business growth projections.
- Drive manufacturing improvement initiatives and cost reduction programs while maintaining product quality and reliability.
- Manage engineering change control processes (ECOs, PCNs) affecting manufacturing processes or materials.
- Troubleshoot and resolve complex manufacturing issues including yield excursions, quality escapes, and process deviations.
- Partner with Quality organization to investigate and drive corrective actions for field returns, quality incidents, and customer complaints related to manufacturing.
- Establish and monitor manufacturing quality metrics including DPPM, first pass yield, Cpk, and reliability test results.
- Build, mentor, and lead a team of sustaining engineers supporting OSAT operations.
- Facilitate review of OSAT technical roadmap for assembly and test capabilities aligning with Business Units product roadmap requirements.
- Provide technical guidance on packaging technology selection and manufacturing process best practices.
Requirements
- Bachelor’s degree in electrical engineering, mechanical engineering or related technical field.
- Minimum 12-15 years of experience in semiconductor manufacturing engineering with at least 5 years in leadership roles.
- Deep technical expertise in semiconductor assembly processes and packaging technologies (wirebond, flip chip, advanced packaging).
- Strong understanding of semiconductor test engineering.
- Proven track record managing and driving performance improvements across external manufacturing partners.
- Experience with high-volume semiconductor manufacturing, yield analysis, and statistical process control.
Benefits
- Health insurance
- Professional development opportunities
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Tech skills
Location requirements
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