Hybrid PIC Design, Modulator Development

at Nokia

• Job title: PIC Design, Modulator Development
• Job type: Full Time
• Experience level: Mid level, Senior
• Salary: $139,284 - $258,670 per year
• Degree requirement: Postgraduate Degree
• Location requirements: Hybrid, Sunnyvale, United States

About the role

• PIC Design and modulator Development in Optical Networks division focusing on high speed integrated photonic components and performance verification.

Responsibilities

• Engage in simulation, data analysis and lead product development from reliable design concepts, performance verification and optimization and transfer to manufacturing.
• Hands-on work in the design of high speed integrated photonic components, especially electro-absorption modulators.
• Implement the designs through the fab and test the resulting circuits to verify performance.

Requirements

• Ph.D in Electrical Engineering, Photonics or a related discipline with emphasis in optical communications and high speed optical components.
• Desired are candidates with significant industrial experience in the optical components industry.
• Deep understanding and hands-on experience with electro-absorption modulators.
• Experience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devices.
• Experience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
• Strong background with semiconductor optical devices such as laser, detectors, modulators and other integrated waveguide devices along with a working level understanding of associated electronic circuitry.
• A strong understanding of optical components design for performance and reliability, especially for devices such as lasers, SOAs, high speed modulators and detectors.
• Experience in creating designed experiments to map device performance.
• Ability to work in an integrated team environment.
• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
• Job will require frequent interaction with fab, test and reliability engineering, packaging and system engineering groups, as well as with product engineering personnel.