Architectural leadership for next-generation DRAM products at Micron. Define DRAM system architectures and collaborate across technology domains for high-performance memory solutions.
Responsibilities
Define and evolve DRAM system architectures that address performance, capacity scaling, reliability (RAS), and observability requirements.
Collaborate across functions to evaluate architectural trade‑offs spanning DRAM silicon, packaging, modules, boards, and system platforms.
Influence host memory controller and platform architecture through technical engagement with CPU, GPU, and SoC partners.
Contribute to RAS and telemetry feature definition, translating system‑level needs into implementable architectural concepts.
Support exploration of emerging memory technologies and assess their impact on future product roadmaps.
Engage with customers, product teams, and business partners to communicate architectural direction and support informed design decisions.
Serve as a technical mentor and steward, supporting architectural consistency and collaboration across teams.
Requirements
Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Extensive professional experience working with DRAM architecture, memory systems, or advanced semiconductor builds.
Demonstrated experience translating system or customer requirements into architectural or silicon‑level solutions.
Experience collaborating across multiple technical domains (e.g., silicon, packaging, systems, or platforms).
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