Signal Integrity Architect focusing on architectural strategies for high - speed memory interfaces at Micron Technology. Evaluating future interfaces using data - driven analysis in the semiconductor industry.
About the role
- Package Architect at Micron Technology focusing on advanced packaging and system exploration. Defining architectures for future memory systems with extensive experience in package design and simulation.
Responsibilities
- Define and explore advanced package architectures for future memory systems
- Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
- Create hands‑on package designs and models for early feasibility analysis
- Run SI/PI and thermal simulations and translate results into architecture guidance
- Define package requirements and act as extension architecture and engineering
Requirements
- Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
- 10+ years of hands‑on experience in package design or package‑level simulation
- Strong experience with package SI modeling and analysis
- Ability to independently build models and drive conclusions
Benefits
- Health insurance
- 401(k) matching
- Paid family leave
- Paid time-off program
- Paid holidays
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