Principal Engineer creating engineering solutions within Design & Engineering teams at Arcadis, focusing on renewable energy and sustainable practices.
About the role
- Principal Engineer at Marvell developing packaging technology for high performance computing and AI. Collaborating on innovative solutions for complex signal integrity and power delivery networks.
Responsibilities
- Develop packaging technology roadmap for AI XPU
- Explore technologies beyond what is currently available and make recommendations
- Create new package technology concepts and perform routing feasibility studies
- Define package architecture and lead co-design efforts across various engineering disciplines
- Partner with silicon design teams to co-optimize die floorplan and bump map requirements
- Drive package qualification and reliability validation to volume readiness
Requirements
- 15+ years of related professional experience in mechanical engineering, material science or related fields, or master's with 12+ years, or PhD with 8+
- Experience in advanced package and substrate technologies
- Deep understanding of process and materials, component and board level reliability
- Experience managing substrate and assembly material vendors
- Deep knowledge of Electrical Engineering concepts
- Experience in signal and power integrity simulations for 2.5D and 3D packages
- Ability to determine optimal signal routing and package size determination
- Ability to manage programs involving cross-functional teams
- Strong understanding of chip-package interactions and failure mechanisms
- prior experience in data center AI accelerators, networking silicon, or custom HPC silicon is ideal
- Ability to influence senior stakeholders across architecture, silicon design, system platform engineering, and supply chain
Benefits
- Employee stock purchase plan with a 2-year look back
- Family support programs to help balance work and home life
- Robust mental health resources to prioritize emotional well-being
- Recognition and service awards to celebrate contributions and milestones
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Senior Principal Engineer overseeing the packaging technology roadmap for AI XPU at Marvell. Collaborating across teams to meet high - performance computing and AI needs with advanced packaging solutions.
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