Hybrid Senior Principal Engineer, Advanced Package Technology

at Marvell Technology

• Job title: Senior Principal Engineer, Advanced Package Technology
• Job type: Full Time
• Experience level: Senior
• Salary: $193,700 - $286,600 per year
• Degree requirement: Bachelor's Degree
• Tech skills: Assembly
• Location requirements: Hybrid, United States

About the role

• Senior Principal Engineer overseeing the packaging technology roadmap for AI XPU at Marvell. Collaborating across teams to meet high-performance computing and AI needs with advanced packaging solutions.

Responsibilities

• Own the packaging technology roadmap for AI XPU, XPU-attach and Switch
• Define system-level package architecture including chiplet topology, interposer/substrate scaling, power delivery network strategy, and thermal design envelope
• Architect and evaluate packaging technology choices, including silicon/glass interposers, EMIB/bridge, hybrid bonding, fan-out, and 3D stacking
• Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability
• Work with stakeholders to define and validate advanced design rule roadmap for interposer, substrates and packages
• Work with vendors to define and validate equipment, process and material roadmap
• Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance
• Explore technology feasibility and create proof-of-concept samples
• Collaborate with IP, Si design, package design, production and test teams
• Lead package material selection, substrate stack-up definition, mechanical modeling, and reliability analysis
• Partner with silicon design teams to co-optimize die floorplan, bump map, TSV, and RDL requirements
• Support HBM integration strategy (HBM2E / HBM3 / HBM3E) with interposer or bridge-based designs
• Work with OSATs / Foundry partners to evaluate process capability, manufacturability, yield, and cost
• Perform signal and power integrity trade-off analysis in partnership with SI/PI teams
• Drive package qualification and reliability validation to volume readiness

Requirements

• Leadership experience, either as a people manager or technical lead is a strong plus
• Experience in advanced package and substrate technologies with deep understanding of process and materials, component and board level reliability, warpage and thermal management
• Experience in managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries
• Bachelor’s degree in Mechanical Engineering, Material Science, Electrical Engineering or related fields and 10+ years of related professional experience
• OR Master’s degree and/or PhD in Electrical Engineering, Mechanical Engineering, Material Science, or related fields with 5+ years of experience
• Deep understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
• Strong understanding of chip-package interactions and failure mechanism at component and board level, thermal and warpage management
• Ability to manage programs involving cross-functional teams
• Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe
• Strong communication, presentation and documentation skills

Benefits

• employee stock purchase plan with a 2-year look back
• family support programs to help balance work and home life
• robust mental health resources to prioritize emotional well-being
• recognition and service awards to celebrate contributions and milestones