Packaging Module Development Engineer developing innovative packaging solutions at Intel. Collaborating with teams to advance semiconductor technology and meet industry standards.
Responsibilities
Design and develop advanced packaging solutions, ensuring alignment with performance, reliability, and quality standards.
Collaborate with cross-functional teams to optimize package architecture and designs for product integration.
Conduct finite element analyses and reliability modeling to evaluate packaging performance and ensure robustness.
Apply geometric dimensioning and tolerancing principles to achieve precision in mechanical design and tolerance analysis.
Support the integration of sockets and connectors into packaging designs, maintaining high-level functionality and manufacturability.
Drive quality assurance processes and reliability measurements to mitigate risks and ensure product success.
Leverage surface mount and mechanical design techniques to innovate and refine packaging modules that meet industry standards.
Solve complex technical challenges related to packaging mechanics and deliver solutions that align with Intel's product roadmap.
Requirements
Bachelor's degree in Mechanical Engineering, Material Science, or a related STEM field
4 or more years of experience in packaging design, development, or related areas
1 + years of experience with socket and connector in packaging development
1 + years of familiarity with surface mount techniques and packaging mechanics
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