Hybrid Packaging Module Development Engineer

Posted 4 days ago

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About the role

  • Packaging Module Development Engineer developing innovative packaging solutions at Intel. Collaborating with teams to advance semiconductor technology and meet industry standards.

Responsibilities

  • Design and develop advanced packaging solutions, ensuring alignment with performance, reliability, and quality standards.
  • Collaborate with cross-functional teams to optimize package architecture and designs for product integration.
  • Conduct finite element analyses and reliability modeling to evaluate packaging performance and ensure robustness.
  • Apply geometric dimensioning and tolerancing principles to achieve precision in mechanical design and tolerance analysis.
  • Support the integration of sockets and connectors into packaging designs, maintaining high-level functionality and manufacturability.
  • Drive quality assurance processes and reliability measurements to mitigate risks and ensure product success.
  • Leverage surface mount and mechanical design techniques to innovate and refine packaging modules that meet industry standards.
  • Solve complex technical challenges related to packaging mechanics and deliver solutions that align with Intel's product roadmap.

Requirements

  • Bachelor's degree in Mechanical Engineering, Material Science, or a related STEM field
  • 4 or more years of experience in packaging design, development, or related areas
  • 1 + years of experience with socket and connector in packaging development
  • 1 + years of familiarity with surface mount techniques and packaging mechanics

Benefits

  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation

Job title

Packaging Module Development Engineer

Job type

Experience level

Mid levelSenior

Salary

$115,110 - $219,550 per year

Degree requirement

Bachelor's Degree

Location requirements

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