Agile Test Engineer responsible for ensuring quality in a cutting - edge XDR solution development. Collaborating with teams to design, implement, and automate tests in an Agile environment.
About the role
- Senior RF Test Engineer developing and executing RF test plans for advanced semiconductor technologies at the Texas Institute for Electronics. Collaborating across teams to enhance testing capabilities and process improvements.
Responsibilities
- Develop and execute RF test plans for K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz) microsystems at wafer, die, module, and system levels.
- Perform S-parameter characterization, on-wafer probing, noise figure measurements, and power sweeps using vector network analyzers, spectrum analyzers, and signal generators.
- Design and implement automated test sequences using Python, MATLAB, or LabVIEW to drive measurement instruments and collect production-grade data across process corners and temperature.
- Develop de-embedding methodologies and calibration strategies for high-frequency measurements, including TRL, LRRM, and multi-line calibrations for on-wafer and package-level probing.
- Correlate measured RF results against EM simulation models (HFSS, ADS, AWR, CST) to validate design intent and feed deviations back to the design and packaging teams.
- Characterize passive and active RF components—including transmission lines, filters, LNAs, PAs, and T/R modules—within 3.0D heterogeneously integrated assemblies.
- Support test infrastructure buildout, including fixture design, probe card specification, and lab setup for TIE’s RF characterization capabilities.
- Author test reports, standard operating procedures, and design-for-test guidelines to support ecosystem partners and internal engineering teams.
Requirements
- M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
- 5+ years of hands-on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K-band frequencies and above.
- Deep working knowledge of S-parameter measurement, VNA calibration techniques, de-embedding, and on-wafer probing methodologies.
- Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.
- Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test-to-model correlation.
- Understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.
- Ability to work cross-functionally with design, packaging, EDA, and process teams in a fast-paced R&D environment.
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