Hybrid Principal Hardware Architect – Platform Architecture

at General Motors

• Job title: Principal Hardware Architect – Platform Architecture
• Job type: Full Time
• Experience level: Lead
• Salary: $228,900 - $350,500 per year
• Degree requirement: Bachelor's Degree
• Location requirements: Hybrid, Mountain View, United States

About the role

• Principal Hardware Architect defining and driving the hardware architecture for GM’s next-generation vehicle platforms. Leading tradeoff analysis and collaborating across hardware, software, and vehicle architecture teams.

Responsibilities

• Define and evolve GM’s zonal hardware architecture, balancing performance, cost, scalability, and reliability.
• Lead tradeoff analysis across compute partitioning, networking, harnessing, and ECU design.
• Translate semiconductor technology roadmaps into platform-level hardware requirements.
• Define physical layer network topology and constraints for in-vehicle communication (Ethernet, CAN, LIN, PCIe, etc.).
• Decompose system-level requirements into ECU- and harness-level specifications.
• Collaborate with software architects to align hardware and software partitioning on microprocessors.
• Define ECU hardware design requirements, including power, thermal, and signal integrity considerations.
• Provide guidance on high-speed PCB design and layout best practices.
• Ensure manufacturability, reliability, and compliance with automotive standards.
• Partner with vehicle architecture, system architecture, software, and semiconductor teams to ensure cohesive system design.
• Serve as a technical authority and mentor for hardware engineering teams.
• Influence supplier and technology partner roadmaps to align with GM’s long-term strategy.
• Drive adoption of new technologies, tools, and methodologies in hardware architecture.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• 12+ years of experience in hardware/system architecture, with significant experience in automotive or other high-reliability industries.
• Proven track record of defining and delivering complex hardware architectures at scale.
• Deep understanding of zonal architectures and vehicle E/E tradeoffs.
• Strong knowledge of software partitioning on microprocessors and its hardware implications.
• Expertise in physical layer network topology (Ethernet, CAN, LIN, PCIe, SerDes) and constraints.
• Ability to map semiconductor technology capabilities to physical layer and harness requirements.
• Strong background in high-speed PCB design and layout.
• Thorough understanding of vehicle architectures and tradeoff analysis.
• Ability to influence cross-functional teams and drive alignment across hardware, software, and vehicle architecture.
• Strong communication skills for engaging with technical and executive stakeholders.
• Experience mentoring and guiding engineering teams.

Benefits

• medical
• dental
• vision
• Health Savings Account
• Flexible Spending Accounts
• retirement savings plan
• sickness and accident benefits
• life insurance
• paid vacation & holidays
• tuition assistance programs
• employee assistance program
• GM vehicle discounts and more.