Innovative leader defining vision and execution for next-gen networking silicon and co-packaged optics platforms at Nokia. Focused on AI, service providers, and hyperscalers with high-bandwidth systems.
Responsibilities
Define and deliver strategy for silicon ASICs (multi-terabit) and architecture of co-packaged optics platforms across inter / intra Data Center.
Define cross-domain system architecture (ASIC, optics, PCB, backplane, cooling) to meet AI network requirements in performance, cost, power, space, efficiency, telemetry, and modularity
Lead definition of integrated system development: hardware, optics, thermal, cooling, and packaging
Collaborate with hyperscaler and service provider customers to align product features with real-world deployment needs
Lead innovation in co-packaged optics, open standards, and partner ecosystems (Inphi, OIF, IEEE)
Evangelize AI networking advantages / impacts to enterprise, hyperscalers, and service providers
Gain industry mindshare, publish in leading conferences, represent the company in standards bodies, and foster R&D and academic partnerships
Partner / Mentor team as well as cross organizations in R&D, PLM, Marketing, Services and Sales ensuring company success
Requirements
Ph.D. or equivalent in EE, IC, Optical/Network Architecture
15+ years in high-performance system architecture: ASICs, optics, PCB, thermal management
Experience defining and executing on multi terabit platforms
Experience scaling architectures across data center and network infrastructure for scale
Strong publication and patent portfolio; leadership in standards and ecosystem initiatives
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